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IPC-A-600
Acceptability of Printed Boards
Course Description
The IPC-A-600 Training and Certification Program provides industry-recognized, technically accurate
training for individuals involved in the fabrication, assembly and inspection of printed circuit boards
(PCBs). Implementing this training signals a company’s commitment to continuous quality
improvement and rigorous standards compliance.
Course Objectives
This course is designed to certify Operators/Inspectors in identifying characteristics that may occur
either internally or externally in the printed circuit board. This includes characteristics in the base
material, plated-through-holes, internal conductive copper pattern, treatments to the internal copper,
and internal planes.
At the end of the course, participants will be fully equipped to correctly interpret and apply visual
acceptability criteria to reduce scrap, improving inspection efficiency, and streamline communication
between suppliers and manufacturers. For those pursing the trainer track, the course also aims to
develop the explicit skills required to teach the lesson plan effectively to others.
Depending on the level of certification pursued, the program awards the following credentials and
this certification has a validity of 2 years and can be recertified upon expiry.
1. Certified IPC Specialist certification (CIS)
2. Certified Standards Expert certification (CSE)
3. Certified IPC Trainer certification (CIT)
Target Audience
1) Printed Board Manufacturers;
2) Electronics Assembly Companies;
3) OEMS, Designers and Supplier
Course Structure
The course is structured around the IPC-A-600 Program and covers critical areas of PCB
fabrication, material conditions, and instructional skills. The curriculum is divided into the following
key focal areas:
1. Board Classifications & Base Materials
– Printed board product classifications and standard acceptance criteria.
– Base material surface and subsurface conditions (e.g. measling and crazing).
2. Conductors & Surface Coatings
– Solder resist coverage over conductors and registration to lands.
– Conductor width, spacing, and annular ring requirements.
3. Dielectric & Plated-Through Hole Criteria
– Dielectric material criteria, including etchback, voids, and resin recession.
– Plated-through hole requirements, focusing on copper plating thickness, voids, nodules, and cracks.
4. Specialized Board Technologies
– Acceptance criteria specifically tailored for flexible, rigid-flex, and metal core printed boards.
Duration
24 hours over 3 days.
IPC-A-610
Acceptability of Electronic Assemblies
Course Description
The IPC-A-610 standard focuses on the quality and reliability of electronic assemblies. This
certification program provides industry-essential training for evaluating and inspecting soldered
electronics.
Course Objective
The training goal of this program is to improve individual “discrimination” skills; that is, to improve
accuracy of discrimination between “acceptable” or “unacceptable” electronic assembly per the IPC-
A-610 series. This program will also teach individuals the reasons for the accept/reject criteria to
enhance their motivation and ability to consistently and correctly apply the discrimination criteria.
At the end of the course, participants will be able to understand the core purpose, application, and
integrity of the IPC-A-610 certification program, and master visual inspection criteria for hardware
installation, soldering and component mounting.
Depending on the level of certification pursued, the program awards the following credentials and
this certification has a validity of 2 years and can be recertified upon expiry.
1. Certified IPC Specialist certification (CIS)
2. Certified Standard Expert certification (CSE)
3. Certified IPC Trainer certification (CIT)
Target Audience
1) Anyone responsible for the quality and reliability of electronic assemblies;
2) Trainers and quality supervisors versed in electronic assembly;
3) Engineering and manufacturing supervisors with assembly responsibilities.
Course Structure
Module 1: Introduction/IPC Professional Policies and Procedures; Foreword, Applicable Documents, & Handling
Module 2: General Soldering Requirements
Module 3: Component Damage and Printed Circuit Boards and Assemblies
Module 4: Terminal Connections
Module 5: Through Hole Technology
Module 6: Surface Mount Assemblies
Duration
32 hours over 4 days.
IPC/WHMA-A-620
Requirements and Acceptance for Cable and Wire Harness Assemblies
Course Description
IPC/WHMA-A-620 Training and Certification Program is an industry developed program that
provides comprehensive technically accurate training based on the IPC/WHMA-A-620 standard. It
serves as a vital benchmark for ensuring the quality, integrity, and reliability of cable and wire
harness assemblies.
Course Objective
The primary objective of the program is to establish a standardized level of excellence across the
wire harness industry by issuing industry-recognized credentials. The program offers endorsement
tracks for different certification level.
At the end of the course, participants will master the visual and technical criteria required to
manufacture, test, and inspect compliant cable assemblies.
Depending on the level of certification pursued, the program awards the following credentials and
this certification has a validity of 2 years and can be recertified upon expiry.
1. Certified IPC Specialist certification (CIS)
2. Certified Standard Expert certification (CSE)
3. Certified IPC Trainer certification (CIT)
Target Audience
1) Assembly Process Engineers;
2) Quality Assurance supervisors;
3) Training Managers;
4) Operational Teams responsible for the quality and reliability of cable and wire harness assembles.
Course Structure
Module 1: Introduction/IPC Professional Policies and Procedures;
-Foreword and Applicable Documents;
-Cable/wire preparation;
-Measuring Cable Assemblies;
-Testing Cable Assemblies.
Module 2: Crimp Terminations;
-Insulation Displacement Connections
Module 3: Soldered Terminations
Module 4: Connectorization and Molding/Potting
Module 5: Splices
Module 6: Marking/Labelling;
-Wire Bundle Securing;
-Shielding;
-Protective Coverings;
-Finished Assembly Installation
Module 7: Coaxial and Biaxial Cable Assemblies
Module 8: Odorless Wire Wrap
Duration
32 hours over 4 days.
IPC J-STD-001
Requirements for Soldered Electrical and Electronic Assemblies
Course Description
The IPC J-STD-001 Training and Certification Program is an industry-recognized framework focused
on the requirements for soldered electrical and electronic assemblies. This certification program
allows companies to highlight their commitment to continuous operations, rigorous quality
assurance, and ongoing product improvement.
Course Objective
The primary objective of this program is to provide comprehensive, hands-on mastery of the
materials, methods, and verification criteria used to produce high -quality soldered interconnections.
The course accommodates different certification levels.
At the end of the course, participants will understand general soldered connection acceptance
requirements (including lead-free manufacturing), machine processes, and industry test methods.
Depending on the level of certification pursued, the program awards the following credentials and
this certification has a validity of 2 years and can be recertified upon expiry.
1) Certified IPC Specialist certification (CIS)
2) Certified Standard Expert certification (CSE)
3) Certified IPC Trainer certification (CIT)
Target Audience
1) Assembly Process Engineers;
2) Quality Assurance Supervisors;
3) Training Managers;
4) Operational staff responsible for the quality and reliability of soldered electronic assembles.
Course Structure
The curriculum balances theoretical knowledge with practical lab work and demonstrations. The
topics are organized in the following modules:
Module 1: Overview of J-STD-001
Module 2: Terminal Post Soldering
Module 3: PCB requirements & Adhesives
Module 4: Through Hole Component Soldering
Module 5: Surface Mount Component Soldering
Module 6: Inspection Module
Duration
40 hours over 5 days.
IPC-7711/7721
Rework of Electronic Assemblies/Repair and Modification of Printed Boards and Electronic Assemblies
Course Description
The IPC-7711/7721 Training and Certification Program is an advanced, skills-based program focused on the rework, modification, and repair of printed circuits boards and electronic assemblies.
This certification program is explicitly not an introductory course for hand soldering or basic rework. Instead, it uses step-by-step process instructions designed to build directly upon the existing knowledge, skills, and abilities of the candidate.
Course Objective
The primary objective of this program is to validate and enhance a technician’s practical ability to safety rework and repair electronic assemblies without compromising original design integrity. This program offers different level of certification.
At the end of the course, participants will master the specific processes required for complex
component removal, land preparation, circuit board repair, and coating removal.
Depending on the level of certification pursued, the program awards the following credentials and
this certification has a validity of 2 years and can be recertified upon expiry.
1) Certified IPC Specialist certification (CIS)
2) Certified Standard Expert certification (CSE)
3) Certified IPC Trainer certification (CIT)
Target Audience
1) Technicians;
2) Manufacturing Supervisors;
3) Quality Assurance Supervisors.
Course Structure
The curriculum spans product classifications, specialized tools, and advanced physical rework
methodologies. The topics are structured into the following modules:
Module 1: Policies & Procedures; intro to IPC-7711/7721
Module 2: Wire Splicing
Module 3: Conformal Coating Removal
Module 4: Through Hole Rework
Module 5: Surface Mount Chip/MELF Rework
Module 6: Surface Mount Chip/Wing Rework
Module 7: Surface Mount J-Lead Rework
Module 8: BGA
Module 9: Laminate Repair
Module 10: Circuit Repair
Duration
40 hours over 5 days.